Ultrasonic Soldering Technolgy by MBR ELECTRONICS GmbH

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Product Information


1. General Information
2. Adhesive Mechanism
3. Adhesive strength
4. Bonding method
Cerasolzer Graph


1. General Information Cerasolzer applied with ultrasonic

Cerasolzer is used in manufacture of electrical parts, to contact electrical / electronically materials and flat glass / metalized glasses because it provides a unique bonding technique that can take the place of commonly used bonding methods like silver baking, indium soldering, molybdenum-manganese and resin (flux).

With conventional soldering methods, glass, ceramic, aluminum and stainless steel are commonly known as non-solderable materials. This is because 'heat' is not enough to bond/solder such substrates and metal oxides.

Ultrasonic vibrations in conjunction with heat cause the required effect and delivers the technical break through. This principle is based on the scientifically recognized 'Ultrasonic Cavitational Phenomenon' which is caused by strong ultrasonic penetration.

The Cerasolzer active-solder alloy together with an ultrasonic activated soldering system enables to solder on ‘hard-to-solder’ materials flux free



2. Adhesive Mechanism Adhesive Mechanism of Cerasolzer 

Although it is quite difficult to completely explain the mechanism of how Cerasolzer adheres to materials, these mechanisms are qualitatively understood as follows:

Since the adhesive property of Cerasolzer is essentially based upon the characteristics of the alloy, ultrasonic vibration is applied to help its bonding process. Cerasolzer contains little amount of elements like Zn, Ti, Si, Al, Be, and Rare Earth which have a strong chemical affinity with oxygen. these metals are thought, during the bonding process, to combine with the oxygen in air to form oxide, which is chemically bound to the surface of the glass, ceramics, metal oxide, etc. Thus, Cerasolzer bonding process proceeds under the liquid-solid reaction between oxides themselves. Such adhesive mechanism has been already confirmed in other areas of glass-metal bonding such as vacuum tube sealing.

Accordingly, if oxygen is competely eliminated by substituting the air surrounding the bonding equipment with an inactive gas, e.g., nitrogen, the adhesion of Cerasolzer will be lost. It has been experimentally found that the critical oxigen concentration for adhesion is about 2%.

A model of chemical bonding between Cerasolzer and the substrate is illustrated in Fig. 15.

Figure 15Fig. 15   Adhesive mechanism of Cerasolzer

When quartz glass is used, the metallic oxides (RO), which are components of Cerasolzer unite chemically with the SiO2 (M) of glass.



3. Adhesive Strength Adhesie Strength of Cerasolzer 

Since Cerasolzer has a number of applications, the adhesive strength of Cerasolzer must be measured by the application. Here, the adhesive strength is described for the lead bonding to soda glass or In2O3 - coated glass performed by the one-step method. Physical and chemical factors should be noticed that particularly affect the bonding performance of Cerasolzer.
Method of adhesive strength measurement: Method of adhesive strength measurement

Figure 5

Peeling strength of each kind of Cerasolzer

Peeling strength of Cerasolzer

Figure 6

Shearing strength of each kind of Cerasolzer

Shearing strength of Cerasolzer

Figure 7

Effect of intensity of ultrasonic vibration on peeling strength

Effect of intensity  of ultrasonic vibration

Figure 8

Influence of contamination of glass surface on peeling strength

Influance of contamination of glass surface

Figure 9

Effect of aging on peeling strength

Effect of aging on peeling strength

Figure 10

Temperature aging test

Temperature aging test

Figure 11

Life test (at 125°C)

Life test 125°C

Figure 12

Humidity test (at 40 ± 3°C, 90 - 95 %RH)

Humidity test

Figure 13

Moisture resistance test

Moisture resistance test

Figure 14

Thermal shock test
Thermal shok test



4. Bonding Method Cerasolzer applied with ultrasonic

When coating glass, ceramics and metal oxide with Cerasolzer, it is necessary to keep complete contact between Cerasolzer and the substrate by employing friction, to eliminate small bubbles which existing in the boundary zone between the surface of the substrate and the molten Cerasolzer.

Practically, this requirenment is most effectively satisfied by applying ultrasonic vibration. For example, upon application of the method to the molten Cerasolzer coated on a transparent glass plate, complete contact between Cerasolzer and the substrate is established to make the boundary zone look like the so-called 'mirror-surface'.

Ultrasonic/Cerasolzer bonding can be performed by three methods:

1. Two-Step Method

Cerasolzer is fed to the nose of a specially made ultrasonic tip and coated on glass, ceramics or metal oxide. Then the metal fittings, lead wire, etc. are soldered on the surface of the Cerasolzer using ordinary solder. This method is convenient to make an airtight seal and to attach large sized metal fittings, lead wire, etc.

2. One-Step Method

While Cerasolzer is sandwiched in a slit between metal and glass or ceramics or metal oxide, ultrasonic vibration is applied directly to the metal. Bonding is performed whithin a very short time. This method is quite adequate for lead bonding on a display panel or on a resistor element.

3. Dipping Method

Cerasolzer is melted in a specific crucible which is equipped with an ultrasonic vibrator. While the molten Cerasolzer has a ripple on its surface caused by ultrasonic vibration, the specimen is dipped in. This method is of good use for whole surface coating with Cerasolzer.


The most important in bonding with Cerasolzer is the surface cleanliness of the substrate - glass, ceramics, metal oxide etc. Such cleanliness does significantly affect the bonding performance of Cerasolzer. In particular, staining with organic substrate (resin, finger-prints, flux for ordinary solder), acid, alkali, powder, carbon, etc must be absolutely avoided. Best cleaning results are achieved by using 'chemically clean' Acetone.